SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents a two-step masking method for making semiconductor chips

Patent drawing from the official filing.

Samsung describes a specific way to build parts of a computer chip using two layers of protective material called masks. The process involves creating patterns on these layers and carefully removing parts of them to expose different sections of the chip base for further processing.

Why it mattersThis filing details a precise manufacturing technique that helps engineers create complex structures inside microchips, which is a standard part of improving how computer processors are built.

In the filing’s own words

A method of fabricating a semiconductor device includes sequentially forming a lower mask layer and an upper mask layer on a substrate having a first region and a second region therein, forming a first mask pattern and a second mask pattern, which are respectively placed on the first region and the second region, on the upper mask layer, removing a portion of the upper mask layer, which is exposed by the second mask pattern, from the second region, then removing the first mask pattern from the first region, and forming an upper mask pattern by etching a remaining portion of the upper mask layer on the first region and on the second region, using the second mask pattern as an etch mask, the upper mask pattern covering the lower mask layer on the first region and exposes a portion of the lower mask layer on the second region.

What exactly they claim (claim 1)

1 - 20. (canceled)

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number: US20260313885A1
Application number: 19711840
Filed: Jun 17, 2026
Published: Oct 8, 2026
Inventors: 5
Claims: 21

Classified under

H10B 12/50 Electricity & electronicsH10B 12/01 Electricity & electronicsH10W 10/0145 Electricity & electronicsH10W 10/17 Electricity & electronicsH10B 12/315 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.