Samsung patents memory chip layout with uneven contact lengths
Samsung describes a design for semiconductor memory chips where the electrical connections to the control lines have varying lengths. The filing details how these uneven contacts connect to pads that overlap with the data storage capacitors within the chip structure.
In the filing’s own words
A semiconductor device includes a substrate, a plurality of semiconductor patterns on the substrate, spaced apart, a bit line connected to one side surfaces of the plurality of semiconductor patterns, a plurality of capacitors respectively connected to the other side surfaces of the plurality of semiconductor patterns, a plurality of word lines respectively crossing the plurality of semiconductor patterns, a plurality of word line pads overlapping the plurality of capacitors, and a plurality of word line contacts connected to at least some of the plurality of word line pads, the plurality of word line contacts being spaced apart, and the plurality of word line contacts having different lengths.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate, a plurality of semiconductor patterns on the substrate, spaced apart in a direction substantially perpendicular to an upper surface of the substrate, a bit line connected to one side surfaces of the plurality of semiconductor patterns along a first direction and extending in a direction substantially perpendicular to the upper surface of the substrate, a plurality of capacitors respectively connected to other side surfaces of the plurality of semiconductor patterns along the first direction, a plurality of word lines respectively crossing the plurality of semiconductor patterns and extending in a second direction intersecting the first direction, a plurality of word line pads overlapping the plurality of capacitors in the second direction, and a plurality of word line contacts extending in a direction substantially perpendicular to the upper surface of the substrate; wherein at least some of the plurality of word line pads are respectively connected to the plurality of word line contacts, wherein the plurality of word line contacts are spaced apart in the first direction, and wherein the plurality of word line contacts have different lengths along the direction substantially perpendicular to the upper surface of the substrate.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING CAPACITORS, WORD LINE PADS AND WORD LINE CONTACTS
- Publication number
- US20260313882A1
- Application number
- 19571425
- Filed
- Mar 18, 2026
- Published
- Oct 8, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10B 12/488 Electricity & electronicsH10B 12/482 Electricity & electronicsH10B 12/485 Electricity & electronicsH10B 12/50 Electricity & electronicsH10B 80/00 Electricity & electronicsH10D 80/30 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.