Samsung patents vapor chamber cooling for phone chips

1. An electronic device comprising: a housing; a display panel defining at least a part of a front side of the housing; a display driver integrated circuit (DDI) connected to the display panel and closer to a top side of the housing than a bottom side of the housing; a processor in the housing and comprising processing circuitry; and a vapor chamber between the DDI and the processor, wherein the vapor chamber comprises: a first heat conductivity member disposed to dissipate heat generated by the DDI and including a first plate and a first wick in contact with the first plate, and a second heat conductivity member disposed to dissipate heat generated by the processor and including a second plate and a second wick in contact with the second plate, wherein the first wick is disposed in an internal space disposed between the first plate and the second plate and includes: a first evaporation portion overlapping at least a part of the DDI and receiving heat generated by the DDI, a first condensation portion spaced apart from the DDI and receiving heat from the DDI, and a first path portion connecting the first evaporation portion to the first condensation portion, wherein the second wick is disposed in the internal space and includes: a second evaporation portion overlapping at least a part of the processor and receiving heat generated by the processor, a second condensation portion spaced apart from the processor, and a second path portion connecting the second evaporation portion to the second condensation portion, and wherein the first path portion of the first wick and the second path portion of the second wick do not overlap each other.