Microsoft patents circuit boards with tiny fluid channels to cool chips
Microsoft has filed a patent for a printed circuit board that includes a network of tiny fluid channels built into its layers. These channels sit directly against heat-producing components to carry away heat, while staying electrically separate from the board's wiring.
In the filing’s own words
A microfluidic printed circuit board (PCB) including: a plurality of layers; a heat-generating component attached to the microfluidic PCB; and a network of microfluidic passages applied to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from traces of one or more of the plurality of layer
What exactly they claim (claim 1)
1. A microfluidic printed circuit board (PCB) comprising: a plurality of layers; a heat-generating component attached to the microfluidic PCB; and a network of microfluidic passages applied to one or more of the plurality of layers and in thermally conductive contact with the heat-generating component, the network of microfluidic passages electrically isolated from traces of one or more of the plurality of layers.
Facts
- Company
- Microsoft (Microsoft Technology Licensing, LLC)
- Official title
- MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING
- Publication number
- US20260313782A1
- Application number
- 19551008
- Filed
- Feb 26, 2026
- Published
- Oct 8, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H05K 1/0212 Electricity & electronicsH05K 1/0272 Electricity & electronicsH05K 3/4688 Electricity & electronicsH05K 7/20327 Electricity & electronicsH05K 2201/064 Electricity & electronicsMore from Microsoft in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
