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MicrosoftPatent applicationChips & hardwareInterest 7/10

Microsoft patents chips with liquid cooling built inside

Patent drawing
Patent drawing from the official filing.

Microsoft describes a processor design where a liquid coolant flows through tiny channels between two chip layers to remove heat. The system uses a special surface to help the liquid turn into vapor, which then carries the heat away from the processor.

Why it mattersThis approach could allow computer chips to run faster and hotter without overheating, potentially improving performance in high-end devices.

In the filing’s own words

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.

What exactly they claim (claim 1)

1. A processing component, comprising: a first die; a wicking heat spreader connected to the first die, including a plurality of channels configured to receive a liquid phase of a working fluid, transfer heat from the first die to the working fluid to produce a vapor phase of a working fluid, and exhaust the vapor phase of the working fluid from the plurality of channels thereby drawing further liquid phase of the working fluid into the plurality of channels; and at least one through-silicon via (TSV) extending through the wicking heat spreader and electrically connected to the first die.

Facts

Company
Microsoft (Microsoft Technology Licensing, LLC)
Official title
3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING
Publication number
US20260305344A1
Application number
19701337
Filed
Jun 8, 2026
Published
Oct 1, 2026
Inventors
5
Claims
20

Classified under

H10W 40/40 Electricity & electronicsH10W 40/43 Electricity & electronicsH10W 40/47 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.