Samsung patents circuit board design that switches signals to waveguide
Samsung describes a multi-layer circuit board structure that converts electrical signals from standard transmission lines into a different format using a specific metal and via arrangement. This converted signal then travels through a waveguide located on the top surface of the board, which is connected to a cavity formed by surrounding vias.
In the filing’s own words
A signal transmission structure including a multi-layer circuit board, a transition structure and cavity structure, the layers including a ground plane and a transmission line, and a waveguide, the transition structure includes a metal plane included in at least one of the layers, a first via electrically connecting the transmission line to the metal plane, and a second via electrically connecting the ground plane to the metal plane, the transition structure is configured to mode-convert a first signal transmitted through the transmission line into a second signal, the cavity structure is configured such that a plurality of vias surrounding side surfaces of the transition structure form side surfaces of the cavity structure, and the waveguide is on an upper surface of a topmost layer among the layers, the waveguide being connected to the cavity structure, and the waveguide being configured to propagate the second signal.
What exactly they claim (claim 1)
1. A signal transmission structure comprising: a first multi-layer circuit board including a plurality of layers, a transition structure and a cavity structure, the plurality of layers including a ground plane and a first transmission line; and a waveguide, wherein the transition structure includes, a first metal plane included in at least one of the plurality of layers, a first via electrically connecting the first transmission line to the first metal plane, and a second via electrically connecting the ground plane to the first metal plane, the transition structure is configured to mode-convert a first signal transmitted through the first transmission line into a second signal, the cavity structure is configured such that, a plurality of vias surrounding side surfaces of the transition structure form side surfaces of the cavity structure, and the waveguide is on an upper surface of a topmost layer among the plurality of layers, the waveguide being connected to the cavity structure, and the waveguide being configured to propagate the second signal.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SIGNAL TRANSMISSION STRUCTURE FOR SIGNAL TRANSMISSION IN MULTI-LAYER CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number
- US20260312270A1
- Application number
- 19633460
- Filed
- Mar 30, 2026
- Published
- Oct 8, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H01P 5/107 Electricity & electronicsH01P 1/16 Electricity & electronicsH01P 3/12 Electricity & electronicsH05K 1/115 Electricity & electronicsH05K 2201/037 Electricity & electronicsH05K 2201/09609 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.