SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents method to optimize dummy fill layouts in chip design

Patent drawing from the official filing.

Samsung describes a method for improving the design of computer chips by adding filler material, known as dummy fill, to specific areas. The system generates potential filler patterns, predicts how these changes affect the chip's physical properties, and selects the best layout based on those predictions.

Why it mattersThis is a routine improvement in semiconductor manufacturing that helps ensure chips are built correctly and consistently, though it is unlikely to be visible to end-users.

In the filing’s own words

A dummy fill layout optimization method includes generating dummy fill candidate patterns corresponding to a target layout, based on data input from a database, predicting a physical property of a layout including the dummy fill candidate patterns, and searching for an optimal dummy fill layout corresponding to the target layout, based on the predicted physical property.

What exactly they claim (claim 1)

1. A dummy fill layout optimization method comprising: generating one or more dummy fill candidate patterns corresponding to a target layout, based on data input from a database; predicting a physical property of a layout including the one or more dummy fill candidate patterns; and searching for an optimal dummy fill layout corresponding to the target layout, based on the predicted physical property.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: DUMMY FILL LAYOUT OPTIMIZATION METHOD AND SYSTEM
Publication number: US20260310873A1
Application number: 19568139
Filed: Mar 16, 2026
Published: Oct 8, 2026
Inventors: 4
Claims: 20

Classified under

G06F 30/392 Physics & computingG06F 30/398 Physics & computingG06F 2111/04 Physics & computingG06F 2111/08 Physics & computingG06F 2111/10 Physics & computingG06F 2111/20 Physics & computing

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.