Samsung patents heat control for tiny light-based data chips
Samsung describes a method to keep tiny light-based data components at the right temperature. It works by measuring the light output and using a small heater to adjust the component's shape so it stays in sync with the data signal.
In the filing’s own words
Provided are systems, methods, and apparatuses for adaptive thermal control for micro-ring modulator in photonic links. In one or more examples, the systems, devices, and methods include receiving a modulation data signal for driving the micro-ring modulator, generating a reference power value based on a duty cycle of the modulation data signal, and sensing an average optical power at a drop port of the micro-ring modulator. The systems, devices, and methods also include comparing the sensed average optical power to the generated reference power value to produce an error signal and using the error signal to regulate a heater associated with the micro-ring modulator to maintain a resonant wavelength of the micro-ring modulator.
What exactly they claim (claim 1)
1. A method for adaptive thermal control of a micro-ring modulator in a photonic link, comprising: receiving a modulation data signal for driving the micro-ring modulator; generating a reference power value based on a duty cycle of the modulation data signal; sensing an average optical power at a drop port of the micro-ring modulator; comparing the sensed average optical power to the generated reference power value to produce an error signal; and using the error signal to regulate a heater associated with the micro-ring modulator to maintain a resonant wavelength of the micro-ring modulator.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- ADAPTIVE THERMAL CONTROL FOR MICRO-RING MODULATORS IN PHOTONIC LINKS
- Publication number
- US20260309943A1
- Application number
- 19415764
- Filed
- Dec 10, 2025
- Published
- Oct 8, 2026
- Inventors
- 4
- Claims
- 20
Classified under
G02B 6/4266 Physics & computingG02B 6/02176 Physics & computingG02B 6/29338 Physics & computingG02B 6/29382 Physics & computingG02B 6/29395 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
