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Samsung patents cooling filter swap for chip-making machines

Patent drawing
Patent drawing from the official filing.

Samsung describes a cooling system for semiconductor manufacturing equipment that uses a stack of three vertical filters. The design includes a blocking panel that can seal off one of the filter sections, allowing technicians to replace that specific part without shutting down the entire air supply.

Why it mattersThis is a maintenance improvement for factory equipment, making it easier to service the air filters that keep sensitive chip-making tools from overheating.

In the filing’s own words

A semiconductor apparatus comprises a substrate processing apparatus; and a cooling system connected to the substrate processing apparatus. The cooling system comprises an air supplier; and a filter unit. The filter unit comprises first to third filter parts stacked in a vertical direction; and a blocking panel located in one of the first to third filter parts. The blocking panel is configured to block a path of air through the one of the first to third filter parts.

What exactly they claim (claim 1)

1. A semiconductor apparatus comprising: a substrate processing apparatus; and a cooling system connected to the substrate processing apparatus, wherein the cooling system comprises: an air supplier; and a filter unit, wherein the filter unit comprises: first to third filter parts stacked in a vertical direction; and a blocking panel located in one of the first to third filter parts, and wherein the blocking panel is configured to block a path of air through the one of the first to third filter parts.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
COOLING SYSTEM, A SEMICONDUCTOR APPARATUS INCLUDING THE SAME, AND A METHOD OF REPLACING A FILTER USING THE SAME
Publication number
US20260309362A1
Application number
19709458
Filed
Jun 16, 2026
Published
Oct 8, 2026
Inventors
1
Claims
20

Classified under

F24F 13/28 Mechanical engineeringF24F 13/10 Mechanical engineeringG03F 7/70858 Physics & computingF24F 2221/56 Mechanical engineering

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.