Samsung patents chip factory system that cleans pipes without stopping pumps
Samsung has filed a patent for a semiconductor manufacturing setup that includes a special bypass pipe. This design allows cleaning gas to flow directly from the supply to the purification unit, skipping the vacuum pump in the middle.
In the filing’s own words
A semiconductor process system includes a process fluid supply, a process chamber configured to receive a process fluid from the process fluid supply, a manifold between the process fluid supply and the process chamber, a scrubber configured to purify the process fluid that is discharged from the process chamber, a vacuum pump between the process chamber and the scrubber, a cleaning gas supply connected to the manifold, and configured to provide the manifold with a cleaning gas and a bypass pipeline that connects the manifold to the scrubber and is configured to bypass the vacuum pump.
What exactly they claim (claim 1)
1. A semiconductor process system, comprising: a process fluid supply; a process chamber configured to receive a process fluid from the process fluid supply; a manifold between the process fluid supply and the process chamber; a scrubber configured to purify the process fluid that is discharged from the process chamber; a vacuum pump between the process chamber and the scrubber; a cleaning gas supply connected to the manifold, and configured to provide the manifold with a cleaning gas; and a bypass pipeline that connects the manifold to the scrubber and is configured to bypass the vacuum pump.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PROCESS SYSTEM AND METHOD OF CLEANING THE SAME
- Publication number
- US20260308756A1
- Application number
- 19715482
- Filed
- Jun 22, 2026
- Published
- Oct 8, 2026
- Inventors
- 4
- Claims
- 20
Classified under
C23C 16/4405 Chemistry & metalsC23C 16/4408 Chemistry & metalsC23C 16/52 Chemistry & metalsH10P 72/0414 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
