/Patent Tracker
SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents chip factory system that cleans pipes without stopping pumps

Patent drawing
Patent drawing from the official filing.

Samsung has filed a patent for a semiconductor manufacturing setup that includes a special bypass pipe. This design allows cleaning gas to flow directly from the supply to the purification unit, skipping the vacuum pump in the middle.

Why it mattersThis is a routine engineering improvement for chip factories that helps maintain clean equipment, though it does not describe a new consumer product.

In the filing’s own words

A semiconductor process system includes a process fluid supply, a process chamber configured to receive a process fluid from the process fluid supply, a manifold between the process fluid supply and the process chamber, a scrubber configured to purify the process fluid that is discharged from the process chamber, a vacuum pump between the process chamber and the scrubber, a cleaning gas supply connected to the manifold, and configured to provide the manifold with a cleaning gas and a bypass pipeline that connects the manifold to the scrubber and is configured to bypass the vacuum pump.

What exactly they claim (claim 1)

1. A semiconductor process system, comprising: a process fluid supply; a process chamber configured to receive a process fluid from the process fluid supply; a manifold between the process fluid supply and the process chamber; a scrubber configured to purify the process fluid that is discharged from the process chamber; a vacuum pump between the process chamber and the scrubber; a cleaning gas supply connected to the manifold, and configured to provide the manifold with a cleaning gas; and a bypass pipeline that connects the manifold to the scrubber and is configured to bypass the vacuum pump.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR PROCESS SYSTEM AND METHOD OF CLEANING THE SAME
Publication number
US20260308756A1
Application number
19715482
Filed
Jun 22, 2026
Published
Oct 8, 2026
Inventors
4
Claims
20

Classified under

C23C 16/4405 Chemistry & metalsC23C 16/4408 Chemistry & metalsC23C 16/52 Chemistry & metalsH10P 72/0414 Electricity & electronics

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.