Samsung patents nested bowls to cut fumes in chip cleaning
Samsung has filed a patent for a multi-layered bowl system used in semiconductor manufacturing. The design features three nested bowls with specific angled walls and widened edges to trap fumes generated when cleaning silicon wafers with liquid.
In the filing’s own words
A bowl assembly is provided in which fume generation can be reduced. The bowl assembly comprises a first bowl provided to surround a substrate support unit supporting a substrate processed with a processing liquid, a second bowl provided to surround the first bowl, and a third bowl provided to surround the second bowl, wherein each of the first bowl, the second bowl and the third bowl is provided with an upper wall that is provided to be inclined upward in a direction toward the substrate support unit, the upper walls include a first upper wall of the first bowl, a second upper wall of the second bowl, and a third upper wall of the third bowl, and each of the first upper wall, the second upper wall, and the third upper wall has an edge, and any one of the first upper wall, the second upper wall and the third upper wall has a structure that is widened toward its edge from a portion adjacent to its edge.
What exactly they claim (claim 1)
1. A bowl assembly comprising: a first bowl provided to surround a substrate support unit supporting a substrate processed with a processing liquid; a second bowl provided to surround the first bowl; and a third bowl provided to surround the second bowl, wherein each of the first bowl, the second bowl and the third bowl is provided with an upper wall that is provided to be inclined upward in a direction toward the substrate support unit, the upper walls include a first upper wall of the first bowl, a second upper wall of the second bowl, and a third upper wall of the third bowl, and each of the first upper wall, the second upper wall, and the third upper wall has an edge, and any one of the first upper wall, the second upper wall and the third upper wall has a structure that is widened toward its edge from a portion adjacent to its edge.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- BOWL ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS COMPRISING THE SAME
- Publication number
- US20260307119A1
- Application number
- 19298010
- Filed
- Aug 12, 2025
- Published
- Oct 8, 2026
- Inventors
- 8
- Claims
- 20
Classified under
B08B 15/02 Operations & transportH10P 72/0414 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.