Samsung patents chip package with metal blocks to help align parts
Samsung describes a semiconductor package design that uses specific metal blocks to cover alignment marks on a baseboard. These wider metal pieces sit over the marks to help ensure the chip is placed correctly during manufacturing.
In the filing’s own words
A semiconductor package includes: an interposer substrate; and a semiconductor chip on the interposer substrate, in which the interposer substrate includes: a bonding pad on a surface of the interposer substrate and connected to the semiconductor chip; an alignment mark spaced apart from the bonding pad in a first direction parallel to the surface of the interposer substrate; and a first metal block and a second metal block, each overlapping with an entire area of the alignment mark in a second direction perpendicular to the surface of the interposer substrate, in which the alignment mark has a first width in the first direction, in which the first metal block has a second width in the first direction, in which the second metal block has a third width in the first direction, and in which each of the second width and the third width is greater than the first width.
What exactly they claim (claim 1)
1. A semiconductor package comprising: an interposer substrate; and a semiconductor chip on the interposer substrate, wherein the interposer substrate comprises: a bonding pad on a surface of the interposer substrate and connected to the semiconductor chip; an alignment mark spaced apart from the bonding pad in a first direction parallel to the surface of the interposer substrate; and a first metal block and a second metal block, each overlapping with an entire area of the alignment mark in a second direction perpendicular to the surface of the interposer substrate, wherein the alignment mark has a first width in the first direction, wherein the first metal block has a second width in the first direction, wherein the second metal block has a third width in the first direction, and wherein each of the second width and the third width is greater than the first width.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE WITH ALIGNMENT MARKS
- Publication number
- US20260305371A1
- Application number
- 19577954
- Filed
- Mar 25, 2026
- Published
- Oct 1, 2026
- Inventors
- 7
- Claims
- 20
Classified under
H10W 46/301 Electricity & electronicsH10W 46/607 Electricity & electronicsH10W 70/618 Electricity & electronicsH10W 90/10 Electricity & electronicsH10W 70/6528 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.