Samsung patents chip package design with extra support pads
Samsung has filed a patent for a semiconductor package that uses a specific arrangement of pads and bumps to hold a chip in place. The design includes a support pad made of insulating material and a dummy area on the wiring board to help stabilize the chip during manufacturing.
In the filing’s own words
A semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (BOT) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support BOT pad.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface; a chip pad disposed on the first surface of the semiconductor substrate and comprising a conductive layer; a support pad disposed on the first surface of the semiconductor substrate, spaced apart from the chip pad, and comprising an insulating layer; an auxiliary support pad disposed under the support pad, and comprising a conductive layer; a support bump connected to the support pad through the auxiliary support pad; a wiring substrate disposed to face the semiconductor substrate; a support bonding on trace (BOT) pad disposed on the wiring substrate and bonded to the support bump; and a dummy area disposed on the wiring substrate and spaced apart from the support BOT pad.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260305356A1
- Application number
- 19695355
- Filed
- Jun 2, 2026
- Published
- Oct 1, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 42/121 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 72/90 Electricity & electronicsH10W 72/263 Electricity & electronicsH10W 72/267 Electricity & electronicsH10W 72/29 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.