Samsung patents chip packages with stacked capacitors
Samsung describes a design for semiconductor packages that places capacitors directly inside the interposer, the layer connecting a chip to its base. The filing details a structure where an upper and lower capacitor unit are stacked face-to-face to save space within the package.
In the filing’s own words
A semiconductor package includes a package substrate, an interposer above the package substrate, a semiconductor chip above the interposer, a capacitor structure in the interposer, the capacitor structure including an upper structure comprising an upper capacitor and a lower structure comprising a lower capacitor, and chip connection terminals between the interposer and the semiconductor chip, where the interposer includes an upper redistribution structure above the capacitor structure, and a lower redistribution structure below the capacitor structure, the upper structure includes a first front surface and a first rear surface that is opposite to the first front surface, the lower structure includes a second front surface and a second rear surface that is opposite to the second front surface, and the first rear surface directly contacts the second rear surface.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a package substrate; an interposer above the package substrate; a semiconductor chip above the interposer; a capacitor structure in the interposer, the capacitor structure comprising: an upper structure comprising an upper capacitor; and a lower structure comprising a lower capacitor; and chip connection terminals between the interposer and the semiconductor chip, wherein the interposer comprises an upper redistribution structure above the capacitor structure, and a lower redistribution structure below the capacitor structure, wherein the upper structure comprises a first front surface and a first rear surface that is opposite to the first front surface, wherein the lower structure comprises a second front surface and a second rear surface that is opposite to the second front surface, and wherein the first rear surface directly contacts the second rear surface.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGES HAVING CAPACITORS
- Publication number
- US20260305324A1
- Application number
- 19703220
- Filed
- Jun 10, 2026
- Published
- Oct 1, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 20/496 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/701 Electricity & electronicsH10W 90/722 Electricity & electronicsH10W 90/724 Electricity & electronicsH10W 90/792 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.