Samsung patents chip design with angled insulating layers
Samsung describes a semiconductor structure where an upper insulating layer sits on a lower one, both surrounding metal wiring. The upper layer extends outward and has a side surface that slopes inward as it goes up, rather than straight up or outward.
In the filing’s own words
A semiconductor device includes a substrate, a metal wiring layer disposed above the substrate, a lower insulating structure disposed on the substrate and in contact with the metal wiring layer, an upper insulating structure disposed on the lower insulating structure, and a metal via disposed on the metal wiring layer and connected to the metal wiring layer, wherein the upper insulating structure extends outward from both side surfaces of the lower insulating structure, and a side surface of the upper insulating structure has a negative slope from a lower surface of the upper insulating structure.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate; a metal wiring layer disposed above the substrate; a lower insulating structure disposed on the substrate and in contact with the metal wiring layer; an upper insulating structure disposed on the lower insulating structure; and a metal via disposed on the metal wiring layer and connected to the metal wiring layer, wherein the upper insulating structure extends outward from both side surfaces of the lower insulating structure, and a side surface of the upper insulating structure has a negative slope from a lower surface of the upper insulating structure.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING METAL WIRING LAYER
- Publication number
- US20260305314A1
- Application number
- 19535688
- Filed
- Feb 10, 2026
- Published
- Oct 1, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10W 20/47 Electricity & electronicsH10W 20/42 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.