Samsung patents image sensor design with new floating diffusion region
Samsung has filed a patent for an image sensor structure that includes a specific arrangement of a photodiode, transfer gates, and a floating diffusion region. The design uses a polysilicon pad pattern and a contact plug to connect the components within the pixel.
In the filing’s own words
An image sensor includes a unit pixel, a pad pattern and a contact plug. The unit pixel includes a photodiode, a pair of vertical transfer gates, and a floating diffusion region. The photodiode is disposed in a substrate and doped with n-type impurities. The pair of vertical transfer gates are disposed on the photodiode, and each of the pair of vertical transfer gates extends through a portion of the substrate. The floating diffusion region is disposed at an upper portion of the substrate between the pair of vertical transfer gates, and includes first impurities. The pad pattern is disposed on the floating diffusion region, and includes polysilicon doped with the first impurities. The contact plug is disposed on an upper surface of the pad pattern.
What exactly they claim (claim 1)
1. An image sensor comprising: a unit pixel including: a photodiode in a substrate, the photodiode being doped with n-type impurities; a pair of vertical transfer gates on the photodiode, each of the pair of vertical transfer gates extending through a portion of the substrate; and a floating diffusion region at an upper portion of the substrate between the pair of vertical transfer gates, the floating diffusion region including first impurities; a pad pattern on the floating diffusion region, the pad pattern including polysilicon doped with the first impurities; and a contact plug on an upper surface of the pad pattern.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- IMAGE SENSOR INCLUDING FLOATING DIFFUSION REGION
- Publication number
- US20260304976A1
- Application number
- 19467338
- Filed
- Feb 2, 2026
- Published
- Oct 1, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10F 39/80373 Electricity & electronicsH10F 39/014 Electricity & electronicsH10F 39/182 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.