Microsoft patents chip layout that keeps memory slots aligned
Microsoft describes a computer chip package where two internal dies face opposite directions. This design allows the memory slots on the motherboard to all point the same way, making them easier to insert and fit more densely.
In the filing’s own words
A two-die integrated circuit (IC) package is coupled to dual in-line memory module (DIMM) connectors. The DIMM connectors are homogeneously-oriented (e.g., in a same direction) but the dies on the IC package are oriented opposite to each other. The DIMM connectors are homogeneously oriented to avoid issues with memory card insertion and to minimize DIMM connector density. Because the DIMM connectors are coupled to both of the dies on the IC package, and the dies are oriented opposite to each other, the sub-channels of the physical interfaces (PHYs) on a second die of the two dies is oriented opposite to the sub-channel interfaces in the DIMM connectors. The second die directs memory transactions of a first sub-channel through a second sub-channel interface driver in the PHY and the other die directs memory transactions of a first sub-channel of the memory through a first sub-channel interface driver in the PHY.
What exactly they claim (claim 1)
1. A system comprising: a system substrate; an integrated circuit (IC) package on the system substrate; and a plurality of dual in-line memory module (DIMM) connectors each having a same longitudinal orientation in a first direction on the system substrate, wherein: the plurality of DIMM connectors comprises: a plurality of first-side DIMM connectors on a first side of the IC package; and a plurality of second-side DIMM connectors on a second side of the IC package; and the IC package comprises: a first die oriented along a die axis extending in the first direction; and a second die oriented opposite to the first die along the die axis.
Facts
- Company
- Microsoft (Microsoft Technology Licensing, LLC)
- Official title
- SYSTEMS INCLUDING TWO-DIE INTEGRATED CIRCUIT (IC) PACKAGES AND HOMOGENEOUSLY-ORIENTED MEMORY CONNECTORS AND RELATED METHODS
- Publication number
- US20260304961A1
- Application number
- 19096355
- Filed
- Mar 31, 2025
- Published
- Oct 1, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10D 89/10 Electricity & electronicsG11C 5/04 Physics & computingH01R 12/721 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Microsoft in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.