Samsung patents stacked silicon layers for memory chips
Samsung describes a memory chip design that stacks multiple thin layers of pure silicon vertically on a base. The filing specifies that these layers are aligned in a specific crystal direction to improve performance, with the bottom layer containing added metal elements.
In the filing’s own words
A semiconductor memory device includes a substrate and a plurality of single crystalline silicon layers arranged in a line in a vertical direction on the substrate and spaced apart from one another in the vertical direction, wherein, in each of the plurality of single crystalline silicon layers, a surface facing a lateral direction substantially orthogonal to the vertical direction is oriented along a (100) crystal plane, and, from among the plurality of single crystalline silicon layers, a lowest-level single crystalline silicon layer closest to the substrate includes metal impurities.
What exactly they claim (claim 1)
1. A semiconductor memory device comprising: a substrate; and a plurality of single crystalline silicon layers arranged in a line in a vertical direction on the substrate and spaced apart from one another in the vertical direction, wherein, in each of the plurality of single crystalline silicon layers, a surface facing a lateral direction substantially orthogonal to the vertical direction is oriented along a (100) crystal plane, and, from among the plurality of single crystalline silicon layers, a lowest-level single crystalline silicon layer closest to the substrate comprises metal impurities.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR MEMORY DEVICE INCLUDING PLURALITY OF SINGLE CRYSTALLINE SILICON LAYERS
- Publication number
- US20260304877A1
- Application number
- 19457682
- Filed
- Jan 23, 2026
- Published
- Oct 1, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10D 62/834 Electricity & electronicsH10B 12/03 Electricity & electronicsH10B 12/482 Electricity & electronicsH10B 12/488 Electricity & electronicsH10B 12/50 Electricity & electronicsH10D 1/714 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.