Samsung patents 2D semiconductor layers with metal contacts
Samsung describes a semiconductor device that uses a channel made of two-dimensional semiconductor material arranged in a specific stacked shape. The design includes source and drain contact structures that wrap around the vertical extensions of the channel to improve electrical connections.
In the filing’s own words
A semiconductor device includes a channel structure, and source and drain contact structures. The channel structure includes a two-dimensional semiconductor material. The channel structure includes a central portion extending in a first direction, and first and second extension portions. The first extension portions are disposed in a vertical direction, and each of the first extension portions extends in the first direction from a first end of the central portion. The second extension portions are disposed in the vertical direction, and each of the second extension portions extends in the first direction from a second end of the central portion. The source contact structure covers lower and upper surfaces and a sidewall of each of the first extension portions of the channel structure. The drain contact structure covers lower and upper surfaces and a sidewall of each of the second extension portions of the channel structure.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a channel structure on a substrate, the channel structure including a two-dimensional semiconductor material, and the channel structure including: a central portion extending in a first direction parallel to an upper surface of the substrate; first extension portions spaced apart from each other in a vertical direction perpendicular to the upper surface of the substrate, each of the first extension portions extending in the first direction from a first end in the first direction of the central portion; and second extension portions spaced apart from each other in the vertical direction, each of the second extension portions extending in the first direction from a second end in the first direction of the central portion; a source contact structure covering lower and upper surfaces and a sidewall of each of the first extension portions of the channel structure; and a drain contact structure covering lower and upper surfaces and a sidewall of each of the second extension portions of the channel structure.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR DEVICES HAVING ALTERNATING LAYERS OF TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL AND METAL
- Publication number
- US20260304872A1
- Application number
- 19570877
- Filed
- Mar 18, 2026
- Published
- Oct 1, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10D 62/292 Electricity & electronicsH10D 30/481 Electricity & electronicsH10D 64/62 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.
