Samsung patents chip layer that tweaks performance using heat
Samsung describes a design for electronic components that uses a specific type of thin material called a transition metal dichalcogenide (TMD) as the main channel. A separate layer is placed on top of this channel to create physical stress, or strain, which changes how the component operates. The two layers expand at different rates when heated, allowing the device to adjust its electrical characteristics.
In the filing’s own words
An electronic device may include a first electrode, a second electrode and separated from the first electrode, a channel layer including transition metal dichalcogenide (TMD) and connected to the first electrode and the second electrode, a gate electrode, and a strain-inducing layer on the channel layer. The gate electrode may be separated from the channel layer, the first electrode and the second electrode. The channel layer, the gate electrode, and the strain-inducing layer may vertically overlap each other. The strain-inducing layer may have a coefficient of thermal expansion different from that of the channel layer.
What exactly they claim (claim 1)
1. An electronic device comprising: a first electrode; a second electrode and separated from the first electrode; a channel layer comprising transition metal dichalcogenide (TMD) and connected to the first electrode and the second electrode; a gate electrode separated from the channel layer, the first electrode and the second electrode; and a strain-inducing layer on the channel layer, wherein the channel layer, the gate electrode, and the strain-inducing layer vertically overlap each other, and wherein the strain-inducing layer has a coefficient of thermal expansion different from that of the channel layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- LAYER STRUCTURES INCLUDING CONFIGURATION INCREASING OPERATION CHARACTERISTICS, METHODS OF MANUFACTURING THE SAME, ELECTRONIC DEVICES INCLUDING LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES
- Publication number
- US20260304848A1
- Application number
- 19704904
- Filed
- Jun 11, 2026
- Published
- Oct 1, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10D 30/791 Electricity & electronicsH10D 30/031 Electricity & electronicsH10D 30/6735 Electricity & electronicsH10D 30/6739 Electricity & electronicsH10D 30/6757 Electricity & electronicsH10D 30/751 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.