Samsung patents chip design with built-in electrical fuses
Samsung has filed a patent for a semiconductor device that includes specific wiring patterns and a small fuse component between them. This fuse is designed to break down electrically if a voltage higher than a set limit is applied, effectively acting as a safety switch within the chip's structure.
In the filing’s own words
Embodiments of the present disclosure provide a semiconductor device comprising: a first intermetallic insulating layer comprising a first interconnection pattern extending in a first direction, a conductive via disposed adjacently to the first interconnection pattern, and a fuse portion disposed between the first interconnection pattern and the conductive via; and a second intermetallic insulating layer comprising a second interconnection pattern disposed on the first intermetallic insulating layer, contacting an upper surface of the conductive via, and extending in a second direction, intersecting the first direction, and the fuse portion is subject to an insulation breakdown when a voltage higher than a critical level is applied between the conductive via and the first interconnection pattern.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a first intermetallic insulating layer comprising a first interconnection pattern extending in a first direction, a conductive via disposed adjacently to the first interconnection pattern, and a fuse portion disposed between the first interconnection pattern and the conductive via; and a second intermetallic insulating layer disposed on the first intermetallic insulating layer and comprising a second interconnection pattern contacting an upper surface of the conductive via and extending in a second direction, intersecting the first direction, wherein the fuse portion is configured such that insulation breakdown occurs when a voltage higher than a critical level is applied between the conductive via and the first interconnection pattern.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICES INCLUDING INTERCONNECTION PATTERNS
- Publication number
- US20260304758A1
- Application number
- 19548467
- Filed
- Feb 24, 2026
- Published
- Oct 1, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10B 20/25 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.