Samsung patents chip layout with extra-wide insulation to protect memory cells
Samsung describes a semiconductor design where a specific insulating layer is made longer than the underlying semiconductor material. This layout places the insulation between the semiconductor and a word line, a wire used to activate memory cells, to better isolate the components.
In the filing’s own words
A semiconductor device includes a bit line extending in a first direction, a word line extending in a second direction intersecting the first direction, a semiconductor pattern disposed adjacent to the word line, a back gate electrode spaced apart from the word line with the semiconductor pattern interposed therebetween, and an isolation insulating pattern spaced apart from the semiconductor pattern with the word line interposed therebetween. A length of the isolation insulating pattern in a third direction is greater than a length of the semiconductor pattern in the third direction, the third direction being perpendicular to the first direction and the second direction.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a bit line extending in a first direction; a word line extending in a second direction intersecting the first direction; a semiconductor pattern adjacent to the word line; a back gate electrode spaced apart from the word line, the semiconductor pattern being interposed between the back gate electrode and the word line; and an isolation insulating pattern spaced apart from the semiconductor pattern, the word line being interposed between the isolation insulating pattern and the semiconductor pattern, wherein a length of the isolation insulating pattern in a third direction is greater than a length of the semiconductor pattern in the third direction, the third direction being perpendicular to the first direction and the second direction.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE
- Publication number
- US20260304746A1
- Application number
- 19423196
- Filed
- Dec 17, 2025
- Published
- Oct 1, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10B 12/315 Electricity & electronicsH10B 12/05 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.