Samsung patents 3D memory layout with new separation structure
Samsung describes a semiconductor design where memory cells are stacked in layers to save space. The filing details a specific structure that separates the base layer from the vertical data lines to improve the device's physical layout.
In the filing’s own words
A semiconductor device includes a substrate, a plurality of semiconductor patterns extending in a first horizontal direction, above the substrate, and spaced apart from one another in a second horizontal direction and a vertical direction, which intersect the first horizontal direction, the plurality of semiconductor patterns each including a first end and a second end, a bit line connected to the first ends of the plurality of semiconductor patterns and extending in the vertical direction, a plurality of word lines extending in the second horizontal direction, above the plurality of semiconductor patterns, and a lower separation structure partially passing through the substrate in the vertical direction and located between the substrate and the bit line, the lower separation structure extending above the substrate to cover at least one semiconductor pattern.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate; a plurality of semiconductor patterns extending in a first horizontal direction, above the substrate, and spaced apart from one another in a second horizontal direction and a vertical direction, which intersect the first horizontal direction, the plurality of semiconductor patterns each comprising a first end and a second end; a bit line connected to the first ends of the plurality of semiconductor patterns and extending in the vertical direction; a plurality of word lines extending in the second horizontal direction, above the plurality of semiconductor patterns; and a lower separation structure partially passing through the substrate in the vertical direction and located between the substrate and the bit line, the lower separation structure extending above the substrate to cover at least one semiconductor pattern.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICES
- Publication number
- US20260304738A1
- Application number
- 19420633
- Filed
- Dec 15, 2025
- Published
- Oct 1, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10B 12/30 Electricity & electronicsH10B 12/03 Electricity & electronicsH10B 12/05 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.