Samsung patents circuit board design that separates power and signal paths
Samsung has filed a patent for a circuit board layout that places power lines and signal lines in separate sections. The design uses a conductive layer over the power section and an insulating layer over the signal section, both sandwiched between a base and a shielding layer.
In the filing’s own words
The present disclosure relates to a circuit board. The circuit board according to an embodiment of the present disclosure may comprise a substrate layer positioned on a first portion of the circuit board and a second portion of the circuit board, the second portion being different from the first portion, a power line positioned on the first portion of the circuit board, a signal line positioned on the second portion of the circuit board, a shielding layer spaced apart from the power line and the signal line, and a cover layer positioned between the substrate layer and the shielding layer, wherein the cover layer includes a cover substrate layer positioned on the first portion and the second portion of the circuit board, a conductive layer positioned on the first portion of the circuit board to correspond to the power line and positioned between the cover substrate layer and the shielding layer, and an insulating layer positioned on the second portion of the circuit board to correspond to the signal line and disposed between the cover substrate layer and the shielding layer.
What exactly they claim (claim 1)
1. A circuit board comprising: a base layer positioned in a first portion of the circuit board and a second portion of the circuit board different from the first portion of the circuit board; a power line positioned in the first portion of the circuit board; a signal line positioned in the second portion of the circuit board; a shielding layer spaced apart from the power line and the signal line; and a cover layer disposed between the base layer and the shielding layer, wherein the cover layer includes: a cover base layer positioned in the first portion and the second portion of the circuit board, a conductive layer positioned in the first portion of the circuit board to correspond to the power line, and disposed between the cover base layer and the shielding layer, and an insulating layer positioned in the second portion of the circuit board to correspond to the signal line, and disposed between the cover base layer and the shielding layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number
- US20260304598A1
- Application number
- 19675825
- Filed
- May 13, 2026
- Published
- Oct 1, 2026
- Inventors
- 2
- Claims
- 15
Classified under
H05K 1/0218 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.