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SamsungPatent applicationChips & hardwareInterest 5/10

Samsung patents stacked chips with two types of cooling pads

Patent drawing
Patent drawing from the official filing.

Samsung describes a design where one chip is stacked on top of another, both connected to a heat spreader. It uses two different thermal interface materials: a stiffer pad under the lower chip and a softer pad covering the upper chip to manage heat flow.

Why it mattersThis approach could help manage heat in compact devices by using materials with different physical properties to fit stacked components better.

In the filing’s own words

An electronic device including: a printed circuit board; a first package including first circuitry and disposed on the printed circuit board; a second package including second circuitry and disposed on the first package, wherein the first package includes a first portion on which the second package is disposed and a second portion; a first thermal interface material (TIM) disposed on the second portion of the first package; a second TIM disposed on the second package and the first TIM; and a heat dissipation member thermally connected to the first package and the second package through the first TIM and the second TIM, wherein the first TIM has a stiffness greater than that of the second TIM.

What exactly they claim (claim 1)

1. An electronic device comprising: a printed circuit board; a first package including first circuitry and disposed on the printed circuit board; a second package including second circuitry and disposed on the first package, wherein the first package includes a first portion on which the second package is disposed and a second portion; a first thermal interface material (TIM) disposed on the second portion of the first package; a second TIM disposed on the second package and the first TIM; and a heat dissipation member thermally connected to the first package and the second package through the first TIM and the second TIM, wherein the first TIM has a stiffness greater than that of the second TIM.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
Publication number
US20260304593A1
Application number
19459697
Filed
Jan 26, 2026
Published
Oct 1, 2026
Inventors
5
Claims
20

Classified under

H05K 1/0203 Electricity & electronicsH05K 1/181 Electricity & electronicsH05K 2201/10734 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.