Samsung patents stacked chip design with uneven glue layers
Samsung describes a method for building a semiconductor package by stacking multiple chips using adhesive layers. The process involves cutting one adhesive layer so its top surface sits lower than the bottom of the chip placed above it.
In the filing’s own words
A method of fabricating a semiconductor package includes forming a first semiconductor chip; forming a lower adhesion layer and a second semiconductor chip on the first semiconductor chip; cutting the lower adhesion layer to form a first cutting surface of the lower adhesion layer; and forming an upper adhesion layer and a third semiconductor chip on the second semiconductor chip. A level of an uppermost part of the first cutting surface is lower than a level of a lower surface of the third semiconductor chip.
What exactly they claim (claim 1)
1. A method of fabricating a semiconductor package, the method comprising: forming a first semiconductor chip; forming a lower adhesion layer and a second semiconductor chip on the first semiconductor chip; cutting the lower adhesion layer to form a first cutting surface of the lower adhesion layer; and forming an upper adhesion layer and a third semiconductor chip on the second semiconductor chip, wherein a level of an uppermost part of the first cutting surface is lower than a level of a lower surface of the third semiconductor chip.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number
- US20260293775A1
- Application number
- 19696492
- Filed
- Jun 3, 2026
- Published
- Sep 24, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsB23K 26/38 Operations & transportB23K 26/40 Operations & transportH10W 20/20 Electricity & electronicsH10W 74/016 Electricity & electronicsH10W 74/117 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.