Samsung patents chip stacking method using plastic film to bond layers
Samsung describes a way to build 3D chip packages by stacking silicon dies on top of each other. The layers are held together by a thin, non-conductive plastic film that is heated and pressed to bond the chips, creating a smooth edge that is ground flat during manufacturing.
In the filing’s own words
A semiconductor package includes: a buffer die; a first core die disposed on the buffer die; a second core die disposed on the first core die; a first non-conductive film (NCF) disposed between the first core die and the second core die and bonding the first core die and the second core die to each other; a first molding layer at least partially surrounding a side surface of the first core die; and a second molding layer surrounding the first NCF and the first molding layer, wherein the first core die, the second core die, and the buffer die are disposed on the second molding layer, wherein a side surface of the first molding layer and a side surface of the first NCF form a coplanar surface.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor package, the method comprising: mounting a first core die on a carrier; disposing a second core die on the first core die, the second core die having a first non-conductive film (NCF) on a lower surface of the second core die; thermocompression bonding the first core die and the second core die to each other through the first NCF, such that a portion of the first NCF protrudes from a space between the first core die and the second core die to form a fillet covering at least a portion of a side surface of the first core die; forming a first pre-molding layer covering the first core die, the second core die, and the fillet of the first NCF; simultaneously grinding the first pre-molding layer and the fillet of the first NCF along a scribe lane, such that the first pre-molding layer becomes a first molding layer at least partially surrounding the side surface of the first core die; removing the first core die, the second core die, the first NCF, and the first molding layer from the carrier; disposing the first core die, the second core die, the first NCF, and the first molding layer on a buffer die; and forming a second molding layer surrounding the first NCF and the first molding layer, wherein the first core die, the second core die, and the buffer die are disposed on the second molding layer.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROCESS USING A NON-CONDUCTIVE FILM (NCF)
- Publication number
- US20260293767A1
- Application number
- 19685214
- Filed
- May 22, 2026
- Published
- Sep 24, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 72/0198 Electricity & electronicsH10W 72/07332 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/297 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.