Samsung patents chip package design using trench-filled insulation
Samsung describes a method for building a semiconductor package by stacking one chip on top of another. The design involves cutting a trench into the lower chip's wiring and filling it with an insulating layer that also covers the side of the upper chip.
In the filing’s own words
Provided is a semiconductor package including a first semiconductor device including a first semiconductor substrate, a first interconnect structure on the first semiconductor substrate, and a trench extending into the first interconnect structure and a portion of the first semiconductor substrate, a second semiconductor device on the first semiconductor device, and a cover insulating layer on the first semiconductor device and a side surface of the second semiconductor device, the cover insulating layer including a first portion filling the trench included in the first semiconductor device and contacting the first semiconductor substrate.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor package, the method comprising: providing a wafer-level structure comprising a first semiconductor substrate and a first interconnect structure on the first semiconductor substrate; forming a trench in the wafer-level structure, the trench extending into the first interconnect structure and a portion of the first semiconductor substrate; bonding a second semiconductor device to the wafer-level structure; and forming a cover insulating layer on the wafer-level structure and on a side surface of the second semiconductor device, wherein the forming of the cover insulating layer comprises filling the trench with a first portion of the cover insulating layer, and wherein the first portion of the cover insulating layer contacts the first semiconductor substrate.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
- Publication number
- US20260293752A1
- Application number
- 19687858
- Filed
- May 26, 2026
- Published
- Sep 24, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 74/134 Electricity & electronicsH10W 72/20 Electricity & electronicsH10W 72/90 Electricity & electronicsH10W 74/43 Electricity & electronicsH10W 90/00 Electricity & electronicsH10B 80/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.