Samsung patents stacked chips with uneven protective coating
Samsung describes a semiconductor design where multiple small chips are stacked vertically on top of a larger base chip. The entire stack is covered in a protective plastic layer, or molding, that is thicker on one side than the other to accommodate the different shapes of the chips.
In the filing’s own words
An example semiconductor device includes a first semiconductor chip including a first substrate and a first through electrode penetrating the first substrate, a plurality of second semiconductor chips that include a second substrate that is disposed in a first direction intersecting a surface of the first semiconductor chip and a second through electrode penetrating the second substrate, and are sequentially stacked in the first direction, and a molding layer surrounding the first semiconductor chip and the plurality of second semiconductor chips. A thickness of a first part of the molding layer that is in contact with a side of the first semiconductor chip is different from a thickness of a second part of the molding layer that is in contact with a side of the second semiconductor chip.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a first semiconductor chip comprising a first substrate and a first through electrode, the first through electrode extending into the first substrate; a plurality of second semiconductor chips that comprise a second substrate and a second through electrode sequentially stacked in a first direction intersecting a surface of the first semiconductor chip, the second substrate being disposed in the first direction, and the second through electrode extending into the second substrate; and a molding layer surrounding the first semiconductor chip and the plurality of second semiconductor chips, wherein a first thickness of a first part of the molding layer is different from a second thickness of a second part of the molding layer, the first part of the molding layer contacting a side of the first semiconductor chip, and the second part of the molding layer contacting a side of the plurality of second semiconductor chips.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE COMPRISING STACKED SEMICONDUCTOR CHIPS
- Publication number
- US20260293747A1
- Application number
- 19355643
- Filed
- Oct 10, 2025
- Published
- Sep 24, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10W 74/111 Electricity & electronicsH10B 80/00 Electricity & electronicsH10D 80/30 Electricity & electronicsH10W 74/014 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 74/15 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.