Samsung patents chip packaging method using stacked metal posts
Samsung describes a way to build semiconductor packages by placing a chip on a base layer and surrounding it with vertical metal posts. The structure is sealed with a protective material, then the top is ground flat so a second layer can be attached directly to the chip and posts.
In the filing’s own words
Provided is a method of manufacturing a semiconductor package by forming a first redistribution substrate on a carrier substrate, forming a plurality of through posts on an outer portion of the first redistribution substrate, mounting a first semiconductor chip on a central portion of the first redistribution substrate, forming a sealing member covering the through posts and the first semiconductor chip, exposing top surfaces of the through posts and the first semiconductor chip by grinding an upper portion of the sealing member, and forming a second redistribution substrate over the through posts and the first semiconductor chip. A top surface of the first semiconductor chip contacts a bottom surface of the second redistribution substrate, and the through posts each comprise at least two metal layers..
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor package, the method comprising: forming a first redistribution substrate on a carrier substrate; forming a plurality of through posts on an outer portion of the first redistribution substrate; mounting a first semiconductor chip on a central portion of the first redistribution substrate; forming a sealing member covering the through posts and the first semiconductor chip; exposing top surfaces of the through posts and the first semiconductor chip by grinding an upper portion of the sealing member; and forming a second redistribution substrate over the through posts and the first semiconductor chip, wherein a top surface of the first semiconductor chip contacts a bottom surface of the second redistribution substrate, and the through posts each comprise at least two metal layers.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260293715A1
- Application number
- 19684180
- Filed
- May 21, 2026
- Published
- Sep 24, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10W 70/611 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/701 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.