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SamsungPatent applicationChips & hardwareInterest 4/10

Samsung patents chip package with built-in heat layers

Samsung describes a semiconductor package design that uses a flexible base to hold multiple chips. It adds a resin layer over the chips and a separate heat-dissipating layer on the back to help move heat away from the components.

Why it mattersThis filing focuses on improving how heat is managed in compact electronic components, which is a standard engineering challenge for keeping devices running efficiently.

In the filing’s own words

A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.

What exactly they claim (claim 1)

1. A semiconductor package, comprising: a flexible insulating substrate comprising a first surface and a second surface opposite to the first surface; a first wiring on the first surface of the flexible insulating substrate; a plurality of semiconductor devices on the first surface of the flexible insulating substrate; a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices; and a lower heat dissipation layer on the second surface of the flexible insulating substrate.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
Publication number
US20260293672A1
Application number
19695148
Filed
Jun 2, 2026
Published
Sep 24, 2026
Inventors
2
Claims
20

Classified under

H10W 40/251 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 70/688 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/248 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.