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Samsung patents chip cleaning machine that sprays liquid while spinning

Samsung has filed a patent for a machine used to clean and dry thin sheets of material, known as substrates, during chip manufacturing. The device spins the material while heating it and spraying a cleaning liquid from nozzles arranged in a circle around the center. It also pumps gas into the chamber to raise the pressure before the drying process begins.

Why it mattersThis filing details a specific mechanical setup for cleaning components in semiconductor production, which is a routine improvement in manufacturing efficiency rather than a new consumer feature.

In the filing’s own words

A substrate processing method includes introducing a substrate into a substrate processing apparatus, injecting pressurized gas into the substrate processing apparatus, and drying the substrate after the pressure inside the substrate processing apparatus becomes higher than a first pressure. The substrate processing apparatus includes a process chamber including a process space, a stage, a heater, a rotator configured to rotate the stage, a pressurizing pump, and a cleaning agent discharger. The cleaning agent discharger is on the stage and includes a plurality of discharge nozzles spaced apart in a circumferential direction around a central axis of the stage. The drying of the substrate includes increasing the temperature of the process space to a first temperature or higher using the heater and spraying the cleaning agent from the plurality of discharge nozzles after raising the temperature of the process space to the first temperature or higher.

What exactly they claim (claim 1)

1. A substrate processing method, the method comprising: introducing a substrate into a substrate processing apparatus; injecting pressurized gas into the substrate processing apparatus to increase a pressure inside the substrate processing apparatus to a first pressure or higher; and drying the substrate after the pressure inside the substrate processing apparatus becomes higher than the first pressure, wherein the substrate processing apparatus comprises: a process chamber including a process space; a stage configured to support the substrate; a heater configured to increase a temperature of the process space; a rotator configured to rotate the stage; a pressurizing pump configured to increase a pressure in the process space; and a cleaning agent discharger configured to spray a cleaning agent into the process space, wherein the cleaning agent discharger is on the stage and comprises a plurality of discharge nozzles spaced apart in a circumferential direction around a central axis of the stage, and wherein the drying of the substrate comprises: increasing the temperature of the process space to a first temperature or higher using the heater; and spraying the cleaning agent from the plurality of discharge nozzles after raising the temperature of the process space to the first temperature or higher.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Publication number
US20260293574A1
Application number
19691794
Filed
May 29, 2026
Published
Sep 24, 2026
Inventors
2
Claims
20

Classified under

H10P 72/0414 Electricity & electronicsB08B 3/041 Operations & transportB08B 3/08 Operations & transportB08B 3/10 Operations & transportH10P 70/20 Electricity & electronicsH10P 72/0408 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.