Samsung patents chemical mix to clean metal layers in chips
Samsung describes a liquid solution containing hydrogen peroxide, iodine, and acids used to remove specific metal layers from electronic components. The method targets thin films made of materials like titanium, copper, or tungsten, which are common in chip manufacturing.
In the filing’s own words
Provided are a composition, a method of treating a metal-containing film by using the same, and a method of manufacturing an electronic device by using the same, the composition including an oxidizing agent, phosphoric acid, an organic acid, and an etching controller, wherein the oxidizing agent includes hydrogen peroxide and an iodine-containing compound, the etching controller includes a nitrogen-containing compound, and the composition has a pH of less than 1.
What exactly they claim (claim 1)
1. A method of treating a metal-containing film, comprising: preparing a substrate including the metal-containing film, the metal-containing film including a first region and a second region, the first region including a material different from a material of the second region; and contacting the metal-containing film with a composition; wherein the first region and the second region independently comprise titanium (Ti), indium (In), aluminum (Al), lanthanum (La), scandium (Sc), gallium (Ga), tungsten (W), molybdenum (Mo), ruthenium (Ru), zinc (Zn), hafnium (Hf), cobalt (Co), copper (Cu), or a combination thereof, the composition comprises an oxidizing agent, phosphoric acid, an organic acid, and an etching controller, the oxidizing agent comprises hydrogen peroxide and an iodine-containing compound, the etching controller comprises a nitrogen-containing compound, and the composition has a pH of less than 1.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- COMPOSITION, METHOD OF TREATING METAL-CONTAINING FILM AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number
- US20260293557A1
- Application number
- 19559409
- Filed
- Mar 6, 2026
- Published
- Sep 24, 2026
- Inventors
- 9
- Claims
- 20
Classified under
H10P 50/667 Electricity & electronicsC09K 13/06 Chemistry & metalsH10D 64/027 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.