Samsung patents chip design with new insulation layer between components
Samsung describes a semiconductor device where an isolation pattern is placed between contact structures and on a dummy pattern. This structure sits alongside active patterns, source/drain patterns, and gate electrodes on a substrate. The filing details how these parts are arranged to form the chip's basic circuitry.
In the filing’s own words
A semiconductor device includes: a substrate; active patterns on the substrate; source/drain patterns on the active patterns; a channel pattern on each of the active patterns and between the source/drain patterns; a gate electrode surrounding the channel pattern; contact structures on the source/drain patterns; a dummy pattern between the active patterns; and an isolation pattern between the contact structures and on the dummy pattern.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate; active patterns on the substrate; source/drain patterns on the active patterns; a channel pattern on each of the active patterns and between the source/drain patterns; a gate electrode surrounding the channel pattern; contact structures on the source/drain patterns; a dummy pattern between the active patterns; and an isolation pattern between the contact structures and on the dummy pattern.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR DEVICE INCLUDING ISOLATION PATTERN FORMED BASED ON INSULATING LAYER AND METHOD FOR MANUFACTURING THE SAME
- Publication number
- US20260293280A1
- Application number
- 19691980
- Filed
- May 29, 2026
- Published
- Sep 24, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10D 84/038 Electricity & electronicsH10D 84/0151 Electricity & electronicsH10D 84/83 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.