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Samsung patents chip design with new insulation layer between components

Samsung describes a semiconductor device where an isolation pattern is placed between contact structures and on a dummy pattern. This structure sits alongside active patterns, source/drain patterns, and gate electrodes on a substrate. The filing details how these parts are arranged to form the chip's basic circuitry.

Why it mattersThis is a routine improvement in chip manufacturing that helps manage electrical connections between tiny components, which is essential for making smaller and more reliable processors.

In the filing’s own words

A semiconductor device includes: a substrate; active patterns on the substrate; source/drain patterns on the active patterns; a channel pattern on each of the active patterns and between the source/drain patterns; a gate electrode surrounding the channel pattern; contact structures on the source/drain patterns; a dummy pattern between the active patterns; and an isolation pattern between the contact structures and on the dummy pattern.

What exactly they claim (claim 1)

1. A semiconductor device comprising: a substrate; active patterns on the substrate; source/drain patterns on the active patterns; a channel pattern on each of the active patterns and between the source/drain patterns; a gate electrode surrounding the channel pattern; contact structures on the source/drain patterns; a dummy pattern between the active patterns; and an isolation pattern between the contact structures and on the dummy pattern.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR DEVICE INCLUDING ISOLATION PATTERN FORMED BASED ON INSULATING LAYER AND METHOD FOR MANUFACTURING THE SAME
Publication number
US20260293280A1
Application number
19691980
Filed
May 29, 2026
Published
Sep 24, 2026
Inventors
4
Claims
20

Classified under

H10D 84/038 Electricity & electronicsH10D 84/0151 Electricity & electronicsH10D 84/83 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.