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Samsung patents stacked chip design to improve data storage reliability

Samsung describes a semiconductor device where two layers of circuitry are stacked vertically to save space. The design uses specific metal connections and a protective barrier layer to prevent unwanted material mixing between the stacked components.

Why it mattersThis type of vertical stacking is a standard method for making memory chips smaller and more efficient, which could lead to cheaper or higher-capacity storage drives in the future.

In the filing’s own words

A semiconductor device, includes a first substrate structure including a substrate, circuit devices on the substrate, and first bonding pads on the circuit devices, and a second substrate structure disposed on and connected to the first substrate structure, the second substrate structure including a source structure, gate electrodes stacked and spaced apart from each other below the source structure, first contact plugs electrically connected to the gate electrodes, a second contact plug in an external side of the gate electrodes and electrically connected to the source structure through an upper end of the second contact plug, a diffusion barrier between the second contact plug and the source structure, a level of a lower end of the diffusion barrier being higher than a level of an uppermost surface of the gate electrodes, and second bonding pads being below the gate electrodes and connected to the first bonding pads.

What exactly they claim (claim 1)

1. (canceled)

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
Publication number
US20260293252A1
Application number
19692029
Filed
May 29, 2026
Published
Sep 24, 2026
Inventors
3
Claims
21

Classified under

H10D 62/83 Electricity & electronicsH10D 64/252 Electricity & electronicsH10D 64/62 Electricity & electronicsH10B 41/27 Electricity & electronicsH10B 43/27 Electricity & electronicsH10W 90/792 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.