Samsung patents new step for making smaller computer chips
Samsung has filed a patent application describing a specific method for building semiconductor devices. The process involves creating a temporary structure to carve out space for electrical connections, then lining that space with a thin layer of semiconductor material before filling it. This technique helps control the shape of the internal components during manufacturing.
In the filing’s own words
A method of fabricating a semiconductor device, includes forming a lower pattern and an upper pattern structure forming a dummy gate structure on the upper pattern structure, and comprising a dummy gate electrode and a pre-gate spacer on the dummy gate electrode, and the pre-gate spacer comprising an inner sidewall and a connection sidewall, forming a source/drain recess in the upper pattern structure using the dummy gate structure as a mask, forming a semiconductor liner layer along a profile of the source/drain recess, the semiconductor liner layer comprising a facet surface, forming an etch blocking pattern in contact with the facet surface and the connection sidewall, and forming a semiconductor filling layer on the semiconductor liner layer after the forming of the etch blocking pattern.
What exactly they claim (claim 1)
1 - 23. (canceled)
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number
- US20260293236A1
- Application number
- 19684054
- Filed
- May 21, 2026
- Published
- Sep 24, 2026
- Inventors
- 6
- Claims
- 21
Classified under
H10D 62/116 Electricity & electronicsH10D 64/018 Electricity & electronicsH10D 64/511 Electricity & electronicsH10W 10/014 Electricity & electronicsH10W 10/17 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.