Samsung patents zigzag memory layout to improve chip density
Samsung describes a new design for semiconductor memory chips that arranges data storage channels in a zigzag pattern. This layout uses specific cutting structures to separate the channels, allowing for a more efficient use of space within the chip.
In the filing’s own words
A semiconductor memory device may include a cell substrate, a mold structure including gate electrodes stacked on the cell substrate, a plurality of first and second channel structures extending into the mold structure and being arranged in a zigzag pattern, and a cutting structure disposed between the plurality of first and second channel structures. The cutting structure may include a first portion extending from inside of the first channel structures to inside of the second channel structures in a third direction, the first portion having a line shape having a constant width, and a second portion extending from inside of the second channel structures to inside of the first channel structures in a fourth direction different from the third direction, the second portion having a line shape having a constant width.
What exactly they claim (claim 1)
1. A semiconductor memory device comprising: a cell substrate including a cell region and an extension region; a mold structure including a plurality of gate electrodes sequentially stacked on the cell substrate; a plurality of first channel structures extending into the mold structure, having a sector shape including a first central angle in a plan view, and arranged in a first direction on the cell region; a plurality of second channel structures extending into the mold structure, having a sector shape including a second central angle in a plan view, adjacent to the plurality of first channel structures in a second direction, and arranged in the first direction such that the plurality of first channel structures and the plurality of second channel structures are arranged in a zigzag pattern; and a cutting structure disposed between the plurality of first channel structures and the plurality of second channel structures, wherein the cutting structure includes: a first portion extending from inside of the plurality of first channel structures to inside of the plurality of second channel structures in a third direction, the first portion having a line shape having a constant width in a first width direction perpendicular to the third direction; and a second portion extending from inside of the plurality of second channel structures to inside of the plurality of first channel structures in a fourth direction different from the third direction, the second portion having a line shape having a constant width in a second width direction perpendicular to the fourth direction.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number
- US20260293136A1
- Application number
- 19682644
- Filed
- May 20, 2026
- Published
- Sep 24, 2026
- Inventors
- 2
- Claims
- 1
Classified under
H10B 43/27 Electricity & electronicsG11C 16/0483 Physics & computingH10B 43/10 Electricity & electronicsH10B 43/35 Electricity & electronicsH10B 43/40 Electricity & electronicsH10B 80/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.