Samsung patents chip design with differently shaped capacitors
Samsung has filed a patent for a semiconductor device that uses two types of capacitors in different parts of the chip. The filing describes a memory storage capacitor in the main data area and a power-stabilizing capacitor in the circuit area, noting that their bottom metal plates are arranged in different patterns when viewed from above.
In the filing’s own words
There is provided a semiconductor device comprising a substrate comprising a cell array area and a peripheral circuit area, a cell capacitor disposed on the cell array area of the substrate and comprising a first lower electrode, a first capacitor dielectric layer, and a first upper electrode, and a decoupling capacitor disposed on the peripheral circuit area of the substrate and comprising a second lower electrode, a second capacitor dielectric layer, and a second upper electrode, wherein, from a plan view, an arrangement structure of the first lower electrode is different from an arrangement structure of the second lower electrode.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a substrate comprising a cell array area and a peripheral circuit area; a cell capacitor in the cell array area and comprising one or more first lower electrodes, a first capacitor dielectric layer, and a first upper electrode; and a decoupling capacitor in the peripheral circuit area and comprising one or more second lower electrodes, a second capacitor dielectric layer, and a second upper electrode, wherein, in a plan view, a first arrangement structure of the one or more first lower electrodes is different from a second arrangement structure of the one or more second lower electrodes.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR DEVICE
- Publication number
- US20260293125A1
- Application number
- 19552695
- Filed
- Feb 27, 2026
- Published
- Sep 24, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10B 12/50 Electricity & electronicsH10B 12/09 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.