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Samsung patents angled landing pads for better chip connections

Samsung describes a method for making semiconductor chips that involves creating a specific shape for a connection point called a landing pad. The process uses etching to give the pad flat sides with different angles, which helps connect other parts of the chip more reliably.

Why it mattersThis is a detailed manufacturing technique that improves the physical structure of computer chips, likely helping to make them more stable or efficient, though it is not visible to end users.

In the filing’s own words

A method of fabricating a semiconductor device includes forming an active pattern, forming a gate structure on the active pattern, forming a storage node contact on the active pattern, forming a preliminary pad layer on the storage node contact, and etching the preliminary pad layer to form a landing pad. The landing pad includes a first pad flat sidewall parallel to the first direction, a second pad flat sidewall parallel to the first direction and opposite to the first pad flat sidewall, a third pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall, and a fourth pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall. An angle between the first pad flat sidewall and the third pad flat sidewall is less than an angle between the first pad flat sidewall and the fourth pad flat sidewall.

What exactly they claim (claim 1)

1. A method of fabricating a semiconductor device, the method comprising: forming an active pattern; forming a gate structure extending lengthwise in a first direction on the active pattern; forming a storage node contact on the active pattern; forming a preliminary pad layer on the storage node contact; and etching the preliminary pad layer to form a landing pad, wherein the landing pad comprises: a first pad flat sidewall parallel to the first direction; a second pad flat sidewall parallel to the first direction and opposite to the first pad flat sidewall; a third pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall; and a fourth pad flat sidewall between the first pad flat sidewall and the second pad flat sidewall, wherein an angle between the first pad flat sidewall and the third pad flat sidewall is less than an angle between the first pad flat sidewall and the fourth pad flat sidewall.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
US20260293095A1
Application number
19673033
Filed
May 11, 2026
Published
Sep 24, 2026
Inventors
2
Claims
20

Classified under

H10B 12/315 Electricity & electronicsH10B 12/0335 Electricity & electronicsH10B 61/22 Electricity & electronicsH10B 63/10 Electricity & electronicsH10B 63/30 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.