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Samsung patents tin oxide clusters for making computer chips

Samsung has filed a patent for a chemical coating used in making computer chips. The coating contains tiny clusters of tin oxide and a specific type of compound to help create precise patterns on silicon wafers during manufacturing.

Why it mattersThis is a routine improvement in chip manufacturing materials that helps engineers create finer details on processors.

In the filing’s own words

A positive resist for dry development includes tin oxide nanoclusters, and a compound having Lewis basicity. The tin oxide nanoclusters includes a core structure having tin oxide. At least a portion of the tin oxide nanoclusters includes organic ligands bonded to the core structure. The organic ligands include alkyl groups having 1-20 carbon atoms bonded to a tin element in the core structure.

What exactly they claim (claim 1)

1. A positive resist for dry development, the positive resist comprising: tin oxide nanoclusters; and a compound having Lewis basicity, wherein the tin oxide nanoclusters comprise a core structure comprising tin oxide.

Facts

Company: Samsung (Samsung Electronics Co., Ltd.)
Official title: POSITIVE RESIST FOR DRY DEVELOPMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME AND MULTILAYERED STRUCTURE FORMED USING THE SAME
Publication number: US20260288000A1
Application number: 19570830
Filed: Mar 18, 2026
Published: Sep 24, 2026
Inventors: 5
Claims: 20

Classified under

G03F 7/0043 Physics & computingC08F 12/24 Chemistry & metalsG03F 7/039 Physics & computingG03F 7/168 Physics & computingH10P 76/2041 Electricity & electronics

Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.