Samsung patents chemical mix for cleaning chip surfaces
Samsung has filed a patent for a specific liquid mixture used in making computer chips. This polishing slurry contains a special type of branched polymer that helps clean the surface of semiconductor devices during manufacturing.
In the filing’s own words
Disclosed are a polishing slurry and a method of manufacturing a semiconductor device, the polishing slurry that includes: a branched polymer including a hydrophobic unit, a micelle of the branched polymers, or a combination thereof, and a dispersion medium.
What exactly they claim (claim 1)
1. A polishing slurry, comprising: a branched polymer including a hydrophobic unit, a micelle of the branched polymers, or a combination thereof, and a dispersion medium.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number
- US20260286186A1
- Application number
- 19467278
- Filed
- Feb 2, 2026
- Published
- Sep 24, 2026
- Inventors
- 9
- Claims
- 20
Classified under
C09G 1/04 Chemistry & metalsC08G 65/2609 Chemistry & metalsC08G 65/2612 Chemistry & metalsC08G 65/324 Chemistry & metalsC08G 65/326 Chemistry & metalsH10P 52/403 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.