Samsung patents chip package with laser-marked metal pads
Samsung describes a method for making a semiconductor package that uses a laser to mark a protective layer over metal connections. This process creates specific exposed areas on the metal pads, which are part of the structure that connects the chip to the outside world.
In the filing’s own words
A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor package, the method comprising: forming a first dielectric layer of a redistribution substrate; forming a metal pattern comprising a plurality of concave portions on the first dielectric layer; forming a second dielectric layer on the first dielectric layer and on the metal pattern; and laser marking the second dielectric layer to form a marking region exposing the metal pattern.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260283049A1
- Application number
- 19669227
- Filed
- May 6, 2026
- Published
- Sep 17, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 90/701 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 74/117 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.