Samsung patents micro LED display with new bonding method
Samsung describes a method for making micro LED displays by bonding a panel of tiny light-emitting diodes to a driving circuit using a specific pattern of electrical contacts. The filing details how to align these contacts so that multiple small pads on the display cover each larger pad on the circuit board, ensuring a stable connection. This approach aims to improve the manufacturing process for high-resolution screens made of individual microscopic LEDs.
In the filing’s own words
A micro light-emitting device display apparatus and a method of manufacturing the same are provided. The micro light-emitting device display apparatus includes a display unit including an array of a plurality of micro light-emitting devices, a driving unit backplane, and a bonding structure formed on coupling surfaces, facing each other, of the display unit and the driving unit backplane, and electrically connecting the display unit to the driving unit backplane. The bonding structure includes a plurality of bonding pads on one of the coupling surfaces of the display unit and driving unit backplane, and a dot pad array formed on the other coupling surface in a two-dimensional array to cover the plurality of bonding pads and an area therebetween.
What exactly they claim (claim 1)
1. A method of manufacturing a micro light-emitting device display apparatus, the method comprising: preparing a driving unit backplane, the driving unit backplane comprising a plurality of driving devices and having a first coupling surface on which a plurality of bonding pads are formed apart from each other; preparing a display unit structure in which an epitaxial stack structure of a second semiconductor layer, an active layer, and a first semiconductor layer is formed on a growth substrate, and in which dot pads are formed on the first semiconductor layer in a two-dimensional array; forming a bonding structure by bonding the plurality of bonding pads of the driving unit backplane and the dot pads of the display unit structure to each other; exposing the second semiconductor layer by removing the growth substrate; and forming an array of a plurality of micro light-emitting devices of a display unit, by pixelating the epitaxial stack structure and forming an electrode electrically connected to the second semiconductor layer, wherein the dot pads are formed on a second coupling surface of the display unit structure and are configured to cover the plurality of bonding pads formed on the driving unit backplane and a region between the plurality of bonding pads so that a plurality of dot pads of the dot pads corresponds to each bonding pad of the plurality of bonding pads, wherein each of the plurality of micro light-emitting devices comprises a first electrode between the first semiconductor layer and the dot pads.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- MICRO LED DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260283044A1
- Application number
- 19683064
- Filed
- May 20, 2026
- Published
- Sep 17, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10H 20/01 Electricity & electronicsH10H 20/8312 Electricity & electronicsH10H 20/8514 Electricity & electronicsH10H 20/857 Electricity & electronicsH10H 20/032 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.