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SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents stacked chip design with aligned edges

Samsung describes a method for building semiconductor packages by stacking chips on top of one another. The process involves cutting a wafer to create a base chip with specific internal connections, then placing additional chips and protective layers on top to form a compact unit.

Why it mattersThis filing details a specific manufacturing technique for creating denser computer chips, which is a standard part of the ongoing effort to pack more power into smaller devices.

In the filing’s own words

A method of fabricating semiconductor package, includes mounting a second semiconductor chip on a wafer, forming a second molding layer surrounding the second semiconductor chip on the wafer, forming a preliminary package by performing a cutting process of cutting the wafer and the second molding layer, the cut wafer constitutes a first semiconductor chip, mounting the preliminary package on a first redistribution substrate, mounting a third semiconductor chip on the second semiconductor chip, and forming a second redistribution substrate on the third semiconductor chip, the first semiconductor chip including a through via that extends into the first semiconductor chip, and a side surface of the first semiconductor chip being vertically aligned with a side surface of the second molding layer by the cutting process.

What exactly they claim (claim 1)

1 - 20. (canceled)

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR PACKAGES
Publication number
US20260283034A1
Application number
19673135
Filed
May 11, 2026
Published
Sep 17, 2026
Inventors
3
Claims
21

Classified under

H10W 90/00 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 72/20 Electricity & electronicsH10W 72/30 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.