Samsung patents chip packaging with laser-etched ID codes
Samsung describes a design for semiconductor packages that includes a specific metal layer on top of the chip's protective shell. This layer contains a laser-etched mark, such as letters or symbols, to identify the component.
In the filing’s own words
A semiconductor package includes: an encapsulation layer sealing at least one semiconductor chip; a redistribution level layer arranged on the encapsulation layer; a laser mark metal layer arranged on the redistribution level layer; and a laser mark arranged inside the laser mark metal layer. The laser mark includes letters, numbers, figures, symbols, and recognition codes indicating various pieces of information of the semiconductor package.
What exactly they claim (claim 1)
1. A semiconductor package comprising: an encapsulation layer sealing at least one semiconductor chip; a redistribution level layer arranged on the encapsulation layer; a laser mark metal layer arranged on the redistribution level layer; and a laser mark arranged inside the laser mark metal layer, wherein the laser mark metal layer comprises a first sub-metal layer, a second sub-metal layer, and a third sub-metal layer sequentially stacked on the redistribution level layer in a cross-section.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- SEMICONDUCTOR PACKAGE
- Publication number
- US20260282939A1
- Application number
- 19670162
- Filed
- May 7, 2026
- Published
- Sep 17, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 46/00 Electricity & electronicsH10W 46/101 Electricity & electronicsH10W 46/103 Electricity & electronicsH10W 46/106 Electricity & electronicsH10W 46/407 Electricity & electronicsH10W 46/607 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.