Samsung patents wiring shapes for tighter semiconductor chips
Samsung describes a design for semiconductor wiring lines that end in a specific 'head hammer' shape. A contact plug connects these lines, with its bottom surface positioned higher than the bottom of the wires to manage electrical connections.
In the filing’s own words
A semiconductor device includes a wiring line on a substrate, a first line portion having a line shape in a first direction, a head hammer pattern connected to an end of the first line portion in the first direction; a second wiring line spaced from the first wiring line in a second direction perpendicular to the first direction, the second wiring line including a second line portion parallel to the first line portion; a first contact plug electrically connecting the first line portion and the second line portion, the first contact plug being positioned adjacent to the first end of the first line portion and a second end of the second line portion in the first direction. The first contact plug has a bottom surface higher than a bottom surface of the first and second wiring lines. The upper surface of the first head hammer pattern contacts an insulation material.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a first line pattern including a first line portion extending in a first direction and a first head hammer pattern at a first end of the first line portion; a second line pattern including a second line portion extending in the first direction and a second head hammer pattern at a second end of the second line portion; and a first contact plug on the first line pattern and the second line pattern for electrically connecting the first line pattern and the second line pattern.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICES
- Publication number
- US20260282886A1
- Application number
- 19672321
- Filed
- May 8, 2026
- Published
- Sep 17, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 20/435 Electricity & electronicsH10B 12/0335 Electricity & electronicsH10B 12/482 Electricity & electronicsH10B 12/485 Electricity & electronicsH10W 20/42 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.