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Samsung patents film with alignment marks for chip protection

Samsung has filed a patent for a protective film used during semiconductor manufacturing. The design includes specific alignment marks on both the film and the silicon wafer to ensure the film is placed exactly over the chips.

Why it mattersThis is a routine manufacturing improvement that helps ensure protective layers are applied accurately, reducing waste in chip production.

In the filing’s own words

A semiconductor chip protection film is provided. A semiconductor chip protection film comprises a plurality of sub-films which are attached to a wafer; and a carrier which carries the plurality of sub-films, wherein at least one of the sub-films and the carrier includes a film alignment mark on an upper side, the wafer has a die alignment mark on an upper side, the sub-films are attached at a first position on the wafer, and the first position is a position at which the film alignment mark and the die alignment mark overlap in a first direction.

What exactly they claim (claim 1)

1. A semiconductor chip protection film comprising: a plurality of sub-films which are attached to a wafer; and a carrier which carries the plurality of sub-films, wherein at least one of the sub-films and the carrier includes a film alignment mark on an upper side, the wafer has a die alignment mark on an upper side, the sub-films are attached at a first position on the wafer, and the first position is a position at which the film alignment mark and the die alignment mark overlap in a first direction.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR CHIP PROTECT FILM
Publication number
US20260282835A1
Application number
19419697
Filed
Dec 15, 2025
Published
Sep 17, 2026
Inventors
2
Claims
20

Classified under

H10P 72/7408 Electricity & electronicsH10F 39/182 Electricity & electronicsH10F 39/811 Electricity & electronicsH10W 46/301 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.