/Patent Tracker
SamsungPatent applicationChips & hardwareInterest 2/10

Samsung patents focus rings with specific grain size and resistance

Samsung has filed a patent for a machine part called a focus ring, which holds a silicon wafer in place during chip manufacturing. The filing specifies that the ring must have a very small grain size and low electrical resistance to work effectively in the processing chamber.

Why it mattersThis is a routine improvement to the internal components of chip-making equipment, focusing on material properties rather than a new consumer feature.

In the filing’s own words

A substrate processing method includes classifying a kind of substrate treatment process in which a focus ring is used, classifying a plurality of focus rings, selecting from the classified plurality of focus rings a specific focus ring suitable for a certain substrate treatment process corresponding to the classified kind of substrate treatment process, and performing the certain substrate treatment process using the selected specific focus ring. The operation of classifying the plurality of focus rings includes classifying the plurality of focus rings into two or more grades.

What exactly they claim (claim 1)

1. A substrate processing apparatus, comprising: a process chamber that provides a process space; a chuck disposed in the process space and that supports a substrate; and a focus ring disposed on the chuck, wherein a grain size of the focus ring is equal to or less than about 14.23 μm, and wherein an electrical resistivity of the focus ring is equal to or less than about 1 Ω.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME
Publication number
US20260282782A1
Application number
19667941
Filed
May 5, 2026
Published
Sep 17, 2026
Inventors
1
Claims
20

Classified under

H10P 50/242 Electricity & electronicsH01J 37/32091 Electricity & electronicsH01J 37/32449 Electricity & electronicsH01J 37/32522 Electricity & electronicsH01J 37/32642 Electricity & electronicsH10P 72/0421 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.