Samsung patents image sensor with new conductive pattern
Samsung has filed a patent for an image sensor design that uses a specific conductive layer to connect parts of the sensor's circuitry. This layer sits on an isolation pattern and touches the substrate below the gate, using a material different from the base chip.
In the filing’s own words
An image sensor according to example embodiments of the present disclosure includes: a substrate including pixel regions including each photodiode; a floating diffusion region disposed in each of the pixel regions, on one surface of the substrate; circuit elements transmitting a photoelectric signal according to the charges of the floating diffusion region; and an upper isolation pattern defining the floating diffusion region and the circuit elements on the one surface of the substrate, and at least one of the circuit elements includes: a gate pattern disposed on the one surface of the substrate; and a source/drain region disposed on both side surfaces of the gate pattern, and at least one of the source/drain regions includes a conductive layer disposed on the upper isolation pattern, contacting the substrate below the gate pattern, and including a material different from a material of the substrate.
What exactly they claim (claim 1)
1. An image sensor, comprising: a substrate including pixel regions including each photodiode; a floating diffusion region disposed in each of the pixel regions and configured to store charges transferred from the photodiode, on one surface of the substrate; circuit elements transmitting a photoelectric signal according to the charges of the floating diffusion region; and an upper isolation pattern defining the floating diffusion region and the circuit elements on the one surface of the substrate, wherein at least one of the circuit elements includes: a gate pattern disposed on the one surface of the substrate; and a source/drain region disposed on both side surfaces of the gate pattern, and wherein at least one of the source/drain regions includes a conductive layer disposed on the upper isolation pattern, contacting the substrate below the gate pattern, and including a material different from a material of the substrate.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- IMAGE SENSOR INCLUDING CONDUCTIVE PATTERN
- Publication number
- US20260282583A1
- Application number
- 19546264
- Filed
- Feb 20, 2026
- Published
- Sep 17, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10F 39/807 Electricity & electronicsH10F 39/8023 Electricity & electronicsH10F 39/8037 Electricity & electronicsH10F 39/811 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.