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Samsung patents chip contacts with two layers of different grain sizes

Samsung describes a way to build tiny electrical connections inside a computer chip. The method creates a two-layer contact where the bottom layer has larger crystal grains than the top layer.

Why it mattersThis is a specific manufacturing technique that could help make chip connections more reliable or efficient, but it is a minor detail in the complex process of building modern processors.

In the filing’s own words

A method of manufacturing a semiconductor device includes forming a first contact structure in contact with a source/drain region, and forming a second contact structure on the first contact structure. Forming the second contact structure includes forming a first layer comprising at least one first grain on the first contact structure, and forming a second layer including second grains on the first layer. A size of each of the at least one first grain is greater than a size of each of the second grains.

What exactly they claim (claim 1)

1. A method of manufacturing a semiconductor device, the method comprising: forming a first contact structure in contact with a source/drain region; and forming a second contact structure on the first contact structure, wherein forming the second contact structure comprises: forming a first layer comprising at least one first grain on the first contact structure; and forming a second layer comprising second grains on the first layer, wherein a size of each of the at least one first grain is greater than a size of each of the second grains.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE
Publication number
US20260282445A1
Application number
19679180
Filed
May 15, 2026
Published
Sep 17, 2026
Inventors
6
Claims
20

Classified under

H10D 30/6729 Electricity & electronicsH10D 30/43 Electricity & electronicsH10D 30/6735 Electricity & electronicsH10D 30/6757 Electricity & electronicsH10D 62/121 Electricity & electronicsH10D 64/258 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.